Proceedings chapter
English

Performance of Low-Mass and High Thermal Conductivity Hybrid for High Track Density Environment

Presented atOrlando (Florida), 24th October-1st November 2009
PublisherIEEE
Publication date2009
Abstract

We have fabricated a low-mass and high thermal conductivity hybrid for high track density environment, such as the super LHC experiment. The characteristics of the front-end chip were evaluated with connecting microstrip sensors of different lengths to the ASIC inputs.

Keywords
  • Application specific integrated circuits
  • Microstrip circuits
  • Nuclear electronics
  • Silicon radiation detectors
  • Thermal conductivity
Citation (ISO format)
IKEGAMI, Y. et al. Performance of Low-Mass and High Thermal Conductivity Hybrid for High Track Density Environment. In: Nuclear Science Symposium Conference Record (NSS/MIC). Orlando (Florida). [s.l.] : IEEE, 2009. p. 779–781. doi: 10.1109/NSSMIC.2009.5402271
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Proceedings chapter (Published version)
accessLevelRestricted
Identifiers
ISBN978-1-4244-3961-4
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