Filament architectures in AC conductors: the influence of intergrowths

Everett, J.; Perkins, G.; Volkozub, A.V.; Caplin, A.D.; Dhalle, Marc; Polcari, Albino; Marti, Frank; Huang, Yibing; Flukiger, René-Louis

doi:10.1016/S0921-4534(98)00462-6

Scientific article

English

Filament architectures in AC conductors: the influence of intergrowths

ContributorsEverett, J.; Perkins, G.; Volkozub, A.V.; Caplin, A.D.; Dhalle, Marc; Polcari, Albino; Marti, Frank; Huang, Yibing; Flukiger, René-Louis

Published inPhysica C: Superconductivity and Its Applications, vol. 310, no. 1-4, p. 202-207

Publication date1998

Abstract

Filament isolation is an extremely important factor in multi-filamentary conductors, and attempts have been made to achieve this by incorporating a resistive oxide sheath around individual filaments. However, filament-bridging intergrowths have been observed in conductors with and without the resistive sheath. We present magnetisation results on BSCCO-2223/Ag conductors with different filament configurations, and analyse the data taking into account the effects of magnetic coupling between filaments. All samples studied display some degree of filament bridging.

Keywords

Bi-2223 tape
Intergrowth
Magnetization
Coupling

Affiliation

Faculté des sciences / Section de physique / Département de physique de la matière quantique

Citation (ISO format)

EVERETT, J. et al. Filament architectures in AC conductors: the influence of intergrowths. In: Physica C: Superconductivity and Its Applications, 1998, vol. 310, n° 1-4, p. 202–207. doi: 10.1016/S0921-4534(98)00462-6

Article (Published version)

Identifiers

PID : unige:107489
DOI : 10.1016/S0921-4534(98)00462-6

Commercial URLhttp://linkinghub.elsevier.com/retrieve/pii/S0921453498004626

ISSN of the journal0921-4534

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Filament architectures in AC conductors: the influence of intergrowths

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