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Title

Filament architectures in AC conductors: the influence of intergrowths

Authors
Everett, J.
Perkins, G.
Volkozub, A.V.
Caplin, A.D.
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Published in Physica C: Superconductivity and Its Applications. 1998, vol. 310, no. 1-4, p. 202-207
Abstract Filament isolation is an extremely important factor in multi-filamentary conductors, and attempts have been made to achieve this by incorporating a resistive oxide sheath around individual filaments. However, filament-bridging intergrowths have been observed in conductors with and without the resistive sheath. We present magnetisation results on BSCCO-2223/Ag conductors with different filament configurations, and analyse the data taking into account the effects of magnetic coupling between filaments. All samples studied display some degree of filament bridging.
Keywords Bi-2223 tapeIntergrowthMagnetizationCoupling
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EVERETT, J. et al. Filament architectures in AC conductors: the influence of intergrowths. In: Physica C: Superconductivity and Its Applications, 1998, vol. 310, n° 1-4, p. 202-207. https://archive-ouverte.unige.ch/unige:107489

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Deposited on : 2018-09-07

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