Filament architectures in AC conductors: the influence of intergrowths
Contributeurs/tricesEverett, J.; Perkins, G.; Volkozub, A.V.; Caplin, A.D.; Dhalle, Marc; Polcari, Albino; Marti, Frank; Huang, Yibing; Flukiger, René-Louis
Publié dansPhysica C: Superconductivity and Its Applications, vol. 310, no. 1-4, p. 202-207
Date de publication1998
Résumé
Mots-clés
- Bi-2223 tape
- Intergrowth
- Magnetization
- Coupling
Structure d'affiliation
Citation (format ISO)
EVERETT, J. et al. Filament architectures in AC conductors: the influence of intergrowths. In: Physica C: Superconductivity and Its Applications, 1998, vol. 310, n° 1-4, p. 202–207. doi: 10.1016/S0921-4534(98)00462-6
Fichiers principaux (1)
Article (Published version)
Identifiants
- PID : unige:107489
- DOI : 10.1016/S0921-4534(98)00462-6
ISSN du journal0921-4534