Finite-Element Analysis of Transverse Compressive and Thermal Loads on Nb3Sn Wires With Voids
ContributorsZhai, Y.; D'Hauthuille, L.; Barth, Christian; Senatore, Carmine
Published inIEEE transactions on applied superconductivity, vol. 26, no. 4
Publication date2016
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ZHAI, Y. et al. Finite-Element Analysis of Transverse Compressive and Thermal Loads on Nb3Sn Wires With Voids. In: IEEE transactions on applied superconductivity, 2016, vol. 26, n° 4. doi: 10.1109/TASC.2016.2535784
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- PID : unige:83716
- DOI : 10.1109/TASC.2016.2535784
Journal ISSN1051-8223